[Pitch Black] HYTE Solid Processor Frame – Socket LGA1700

The HYTE Solid Processor Frame (Pitch Black, Socket LGA1700) is a CNC‑machined CPU contact frame that replaces the stock ILM to improve cooler contact, reduce CPU temperatures and prevent bending on Intel LGA1700 platforms. It also supports Intel LGA1851 and AMD AM5 in the same overbuilt design, and comes bundled with HYTE Thermal Goop 2g and an L‑shaped wrench for easy installation. [web:1148][web:1154][web:1153]

• Lowers CPU temps: Optimizes cooler contact and mounting pressure across the IHS, helping reduce core temperatures and stabilize boost clocks on 12th–14th Gen Intel processors. [web:1148][web:1154][web:1153]
• Keeps your CPU pristine: Rigid frame design helps prevent bending and warping of the CPU and socket over time due to ILM clamping force and thermal cycling. [web:1148][web:1154][web:1156]
• Wide compatibility: Supports Intel LGA1700 (12th / 13th / 14th Gen Core), Intel LGA1851 (Core Ultra 200S) and AMD AM5 (Ryzen 7000 / 9000) when used with the appropriate mounting configuration. [web:1148][web:1154][web:1151]
• Overbuilt aluminium body: Anodized Pitch Black aluminium frame elevates the look around your socket and makes thermal paste cleanup easier when upgrading or selling your CPU. [web:1148][web:1154][web:1156]
• Includes Thermal Goop & tools: Package includes 2 g of HYTE Thermal Goop high‑performance thermal paste, an L‑shaped wrench and AM5 mounting screws for a smooth ILM swap. [web:1148][web:1154][web:1155]

Ideal For: Intel LGA1700 gaming and creator builds (and cross‑compat Intel 1851 / AMD AM5 setups) where you want tighter temps, better boost behaviour and a stealth Pitch Black socket aesthetic. [web:1148][web:1151][web:1153]